phyCORE®-i.MX 8M Plus
Edge computing module for accelerated machine learning applications.
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40 mm x 37 mm -
Cortex®-A53 Cortex®-M7 -
NPU Neural Processing Unit -
LVDS, MIPI DSI-2, HDMI
Product Overview
Designed for edge devices that need high-performance AI, advanced multimedia, and reliable industrial connectivity in a single compact platform. The phyCORE®-i.MX 8M Plus System on Module combines powerful processing, integrated machine learning, and extensive I/O to support vision systems, smart HMIs, and complex embedded applications without increasing system complexity.
The phyCORE®-i.MX 8M Plus delivers high-performance edge computing in a compact, connectorized System on Module designed for feature-rich embedded systems. It supports dual camera inputs, high-speed networking with TSN, and advanced display interfaces, making it ideal for vision-based applications, multimedia devices, and complex industrial systems.
Built on Cortex-A53 application cores with a Cortex-M7 real-time processor, the module enables responsive control alongside Linux-based applications. The integrated 2.3 TOPS Neural Processing Unit allows on-device AI processing, reducing latency and enabling real-time decision-making at the edge.
With extensive I/O, proven software support, and PHYTEC engineering expertise, development teams can reduce integration complexity, shorten time to market, and confidently scale advanced embedded designs.
Contact Sales for more information about this product.
When to Choose an i.MX 8M Plus System On Module
Designed for applications where performance, AI capability, and connectivity need to work together in a single platform.
Choose this module if your application requires:
- On-device AI processing for real-time inference without cloud dependency
- Multiple camera inputs for machine vision and image processing systems
- High-performance multimedia for advanced display and UI applications
- Deterministic networking with TSN for time-sensitive industrial systems
- Combined Linux and real-time control for complex embedded workloads
- A compact SOM with extensive I/O for feature-rich product designs
Typical applications include:
- Smart cameras and machine vision systems
- Industrial human-machine interfaces (HMIs)
- Medical imaging and diagnostic devices
- Retail automation and smart kiosks
- Edge AI gateways and analytics devices
- Transport systems and EV infrastructure
- Robotics and autonomous systems
Development and Integration Benefits
- Compact 40 mm x 37 mm form factor to reduce PCB space requirements
- One of the smallest connectorized SOMs to simplify system design
- Extensive I/O to support complex, feature-rich applications
- Linux BSP and software resources to accelerate development
- Access to local engineering support from concept to production
- Reduced development risk compared to fully custom processor boards
Features
On-device Machine Learning
Fast response time with machine learning hardware acceleration. Run your TensorFlow Lite model directly on the device without utilizing all your processor cores.
Low Power Design
Beginning with the NXP 14LPC FinFET process technology at the applications processor, low power design elements are continued on the SOM with selections such as LPDDR4 and use of the NXP codesigned PMIC.
Versatile Display Capabilities
Cost Optimized
Customization options to reduce Bill of Materials including depopulation of connectors as well as the option for direct solder BGA version for complete elimination of connector cost.
Specifications
Processor |
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| Processor | NXP i.MX 8QuadPlus |
| Architecture | Arm Cortex-A53, Arm Cortex-M7 |
| Frequency | 1.8 GHz (per core) / 800 MHz |
Memory |
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| RAM | 256 MB - 8 GB LPDDR4 |
| eMMC | 8 GB default / 64 GB max |
| NOR | 4 MB up to 256 MB Quad SPI Flash |
| EEPROM | 4 KB |
| SD/SDIO/MMC Interfaces | 3x (1x reserved for eMMC) |
High-Speed Interfaces |
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| PCIe | 1x PCIe 3.0 |
| USB | 2x USB 3.0 / 2.0 OTG |
Peripherals |
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| CAN | 2x CAN FD |
| GPIO | Yes |
| I2C | 3 |
| PWM | 4 |
| SPI/SSP | 3x ECSPI |
| UART | 4 |
Connectivity |
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| Ethernet | 2x 10/100/1000 Mbps (TSN Support) |
Multimedia |
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| Display | 1x HDMI, 1x MIPI DSI-2, 2x LVDS |
| Graphics | 2D GPU (Vivante GC520L), 3D GPU (Vivante GC7000UL) |
| Camera | 2x MIPI CSI-2 |
| Audio | SAI, SPDIF, I2S, AC97, TDM |
| Video | Decode - 1080p60 H.264, H.265, VP8, VP9, Encode - 1080p60 H.264, H.265 |
Miscellaneous |
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| JTAG | Yes |
| RTC | Yes |
| Security Accelerators | 3DES, AES, CAAM, DES, DRM, EEC, PKHA, RDC, RNG, RTIC |
Mechanical |
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| Dimensions | 40 mm x 37 mm |
| Connector | 2x 120-pin + 1x 60-pin 0.5 mm |
Operating Conditions |
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| Operating Temperature | -40° to +85° C |
| Supply Voltage | 3.3V |
| Power (Typical) | 1.81 W |
| Power (Max) | 3.72 W |
Hardware Documentation
SOM |
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Hardware Manual
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Component Placement
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Schematic Symbol and Footprint
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Carrier Board |
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Component Placement
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Connectors |
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SOM
Samtec ASP-205225-01 (PHYTEC Article # VB406)
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Carrier Board
Samtec REF-177862-03 (PHYTEC Article # VM240)
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3D Model
Resources |
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3D Files
SOM
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3D Files
Carrier Board
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The i.MX 8M Plus Processor
The NXP i.MX 8M Plus family of application processors revolutionizes edge computing by integrating on-chip machine learning accelerators. The dual or quad Arm Cortex-A53 and real-time Cortex-M7 cores are complemented by NXPs Neural Processing Unit (NPU) operating at 2.3 TOPS for fast response time of machine learning algorithms. In addition 1080p60, h.265/4, VP9, VP8 video decode, 1080p60, h.265/4 encode, dedicated Dual Image Signal Processor (ISPs) with resolution up to 12MP, 3D/2D graphics acceleration, advanced audio, and Cadence® Tensilica® HiFi 4 DSP @ 800 MHz for low power voice acceleration are features that support machine vision as well as audio and voice capabilities.
Software
Linux |
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BSP-Yocto-NXP-i.MX8MP-PD24.1.0
Date: 2024-11-06
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Yocto Scarthgap 5.0.4 |
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