phyFLEX®-IQ2390
FPSC form factor for pin-compatible phyFLEX SOMs
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45 mm x 48 mm -
Arm Cortex®-A78, Arm Cortex®-A55 -
Qualcomm Hexagon™ V66 -
FPSC
Product Overview
The Qualcomm Dragonwing™ IQ-2390 processor family brings powerful application processing, AI acceleration, graphics, multimedia, and connectivity to entry-level embedded systems. With a quad-core Arm® CPU, Qualcomm® Adreno™ GPU, Hexagon™ AI processor, integrated image signal processor (ISP), and dedicated RISC-V MCU, the platform is designed to handle intelligent edge workloads while maintaining the flexibility needed for connected embedded products.
The phyFLEX-IQ2390 enables the full capabilities of the Dragonwing IQ-2390 in a compact, production-ready SOM platform. Built around PHYTEC’s solder down FPSC footprint standard, the module gives developers a flexible, mechanically robust foundation for integrating Qualcomm technology into demanding environments while simplifying hardware development and accelerating time to market.
This system stands apart by bringing Qualcomm’s high-efficiency silicon into true industrial territory for the first time. By integrating local AI, ISP vision pipelines, and a real-time RISC-V MCU on a single low-power chip, it eliminates the need for extra baseboard microcontrollers or discrete accelerators. The result is a rugged, power-efficient foundation for smart cameras, HMIs, robotics, and edge controllers that require local intelligence without cloud dependency.
Features
Edge AI at the Device
The integrated Qualcomm Hexagon™ V66 processor provides up to 1.1 TOPS of INT8 AI performance, enabling local inference for computer vision, classification, detection, and other machine learning workloads. By processing AI workloads at the edge, applications can respond quickly while reducing dependence on cloud connectivity.
Graphics and Multimedia Processing
An integrated Qualcomm® Adreno™ GPU provides hardware acceleration for graphics and embedded user interfaces, while dedicated video processing supports 1080p30 video encode and decode. This combination makes the phyFLEX-IQ2390 well suited for interactive HMIs, smart displays, cameras, and multimedia-enabled embedded products.
Integrated Vision Processing
The Qualcomm Spectra™ ISP supports advanced camera applications with configurations including 13 MP + 13 MP or up to 25 MP at 30 fps ZSL. Combined with the Hexagon AI processor, the platform can capture, process, and analyze visual data directly on the device for applications such as machine vision, smart monitoring, and intelligent automation.
Secure and Flexible Embedded Processing
Hardware security features including Qualcomm® Trusted Execution Environment (TEE), PIMEM 3.0, hardware ECC, and a hardware key manager help protect embedded applications and data. A dedicated SiFive E61 RISC-V MCU provides an additional processing domain for low-level control and real-time tasks.
Specifications
Processor |
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| Processor | Qualcomm IQ2390S |
| Architecture | Arm Cortex-A78 / 3x Arm Cortex-A55 |
| Frequency | Up to 1.8 GHz (A55), Up to 1.9 GHz (A78) |
| Co-Processors | GPU, SiFive E61 RISC-V MCU at 600 MHz |
| DSP | Qualcomm® Hexagon™ v66A (cDSP) |
| AI | 1.1 TOPS |
Memory |
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| RAM | 2GB Default, Up to 16GB LPDDR4 |
| eMMC | 32GB Default, Up to 128GB |
| EEPROM | 2x 4kB I2C |
| SD/SDIO/MMC Interfaces | 1 |
High-Speed Interfaces |
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| USB | 1x 2.0 Dual Role, 1x 3.1 Dual Role |
| PCIe | 1x PCIe 2.0 |
Peripherals |
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| I3C | 1 |
| GPIO | 120 |
| I2C | Up to 10 |
| PWM | 15 |
| SPI/SSP | 7 |
| UART | 9 |
Connectivity |
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| Ethernet | 1x 1Gb, 1x RGMII |
Multimedia |
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| Audio | 1x SWR, 2x DMIC, 4x I2S |
| Camera | 2x MIPI CSI-2 |
| Display | 1x OLDI/LVDS or 1x MIPI-DSI |
| Graphics | 3D GPU (Adreno 704 at 845 MHz) |
| Video | 1080p @ 30 fps |
| WiFi | 1x WLAN |
Miscellaneous |
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| JTAG | Yes |
| RTC | Yes |
| Security Accelerators | Secure Boot, Hardware Supported KeyStore, Qualcomm® Trusted Execution Environment (QTEE5), Secure Debug, Secure Key Provisioning |
Mechanical |
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| Dimensions | 45 mm x 48 mm |
| Connector | 1.27 mm pitch, FPSC-Gamma: Size M 537-pins, Fused Tin Grid Array (FTGA) |
Operating Conditions |
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| Operating Temperature | -30° to +85° C |
| Power (Max) | TBD |
| Power (Typical) | TBD |
| Supply Voltage | 5.0V |
Hardware Documentation
SOM |
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Hardware Manual
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Coming Soon! |
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Component Placement
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Coming Soon! |
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Schematic Symbol and Footprint
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Coming Soon! |
Carrier Board |
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Component Placement
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PHYTEC PinMux Tool
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Coming Soon! |
The Dragonwing IQ-2390 Processor
The Qualcomm® Dragonwing™ IQ-2390 processor family brings high-efficiency mobile architecture directly into the industrial edge for the first time. It combines application processing, high throughput machine vision, and dedicated Hexagon™ AI acceleration with an onboard SiFive RISC-V MCU for deterministic real-time control.
Built for harsh factory floors, the SoC is qualified for industrial thermal ranges and features hardware level ECC memory protection to ensure 24/7 system reliability. Integrated Qualcomm® Trusted Execution Environment (QTEE5) security safeguards critical software workloads, making the platform a robust, power efficient foundation for next generation industrial automation.
3D Model
Sketch-fab model, Coming Soon!
Resources |
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3D Files
SOM
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Coming Soon! |
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3D Files
Carrier Board
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Coming Soon! |
Software
Linux and Android offerings
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Ready to get started?
Let’s go! Learn more about PHYTEC SOMs