phyCORE®-AM67x

Product Overview

A high-performance System on Module designed for advanced vision systems, AI workloads, and real-time industrial control. The phyCORE®-AM67x combines powerful processing, integrated deep learning acceleration, and high-speed connectivity, making it ideal for robotics, medical imaging, factory automation, and next-generation edge devices.

When standard embedded platforms cannot meet performance or processing demands, the phyCORE®-AM67x provides the headroom required for complex, data-intensive systems. Built on the Texas Instruments AM67x platform, this SOM combines quad Cortex-A53 application cores, a dedicated Cortex-R5F real-time core, and dual C7x DSPs with integrated deep learning acceleration, enabling advanced AI inference, high-speed analytics, and deterministic control in a single platform.

Designed for machine vision and sensor-driven applications, it supports multiple camera inputs, high-speed interfaces including PCIe 3.0 and USB 3.1, with flexible connectivity for demanding embedded systems.

With PHYTEC manufacturing expertise and hands-on engineering support, teams can reduce development risk, simplify integration, and move from prototype to production faster.

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When to Choose an AM67x System On Module

Designed for high-performance applications where other application processors cannot meet processing, AI, or real-time requirements.

Choose this module if your application requires:

• High-performance processing for complex, data-intensive workloads
• On-device AI acceleration for machine vision and deep learning applications
• Multiple camera inputs for advanced imaging and vision systems
• High-speed interfaces for real-time data processing and analytics
• Deterministic real-time control for industrial and robotics systems
• A scalable SOM platform for advanced OEM and embedded products

Typical applications include:

• Robotics controllers and autonomous systems
• Smart vision cameras and AI-enabled imaging devices
• Automated inspection and quality control systems
• Medical imaging and diagnostic platforms
• Industrial edge gateways and analytics systems
• Autonomous mobile equipment and vehicles

Development and Integration Benefits

• Compact 55 mm x 39 mm form factor to support high-performance designs in limited space
• Dual DSP architecture to accelerate AI and signal processing workloads
• PCIe 3.0 and USB 3.1 for high-speed data transfer and connectivity
• Secure boot and trusted architecture for secure embedded deployments
• Access to local engineering support from concept through to production
• Faster route to market compared to fully custom high-performance designs