phyCORE®-i.MX 93
Energy-efficient edge computing, accelerated Machine Learning
-
36 mm x 36 mm -
Cortex®-A55, Cortex®-M33 -
Footprint Compatible with i.MX6UL -
Cost optimized
Product Overview
Built for energy-efficient embedded systems that need reliable performance without increasing power consumption or cost. The phyCORE®-i.MX 93 System on Module combines low-power processing, integrated machine learning, and real-time control in a compact form factor, making it ideal for industrial IoT, smart automation, and connected edge devices.
The phyCORE®-i.MX 93 delivers efficient edge computing in a compact, production-ready System on Module designed to reduce development time and system cost. It combines Cortex-A55 application processing with a Cortex-M33 real-time core, allowing you to run Linux-based applications alongside deterministic control tasks on a single platform.
Integrated Arm Ethos-U65 machine learning acceleration enables on-device AI processing, helping reduce latency and reliance on cloud connectivity for edge applications. The compact 36 mm x 36 mm footprint and Direct Solder Connect architecture simplify manufacturing and improve long-term reliability, making it well-suited for high-volume embedded deployments.
Compatibility with selected phyCORE platforms also provides a clear upgrade path, allowing teams to scale designs without full redevelopment.
Contact Sales for more information about this product.
When to Choose an i.MX 93 System On Module
Choose this module if your application requires:
- Low power performance for always-on devices where energy consumption is critical
- On-device AI processing to reduce cloud dependency and improve response times
- Real-time control alongside Linux applications for hybrid workloads
- A compact SOM for space-constrained industrial or embedded systems
- A cost-efficient platform for scalable, high-volume production
- A long-life, upgradeable platform for future-proof product development
Typical applications include:
- Industrial IoT gateways
- Smart building and HVAC controllers
- EV charging infrastructure
- Edge AI-enabled sensors
- Connected medical and healthcare devices
- Secure IoT edge nodes
- Human-machine interfaces (HMIs)
- Smart energy and metering systems
Development and Integration Benefits
- Compact 36 mm x 36 mm form factor to reduce PCB space requirements
- Direct Solder Connect design for simplified assembly and improved reliability
- Low power architecture to minimize thermal management requirements
- Comprehensive BSP and software support to accelerate development
- Access to local engineering expertise from prototyping through to production
- Lower development risk compared to fully custom processor board designs
Features
Direct Solder Connect
Customization Options
Select exactly what you need for your application by scaling RAM up to 2GB, customizing audio and graphics requirements, plus other signal and component options.
Tiny
Feature Rich
Specifications
Processor |
|
| Processor | NXP i.MX 93 |
| Architecture | Arm Cortex-A55 / Arm Cortex-M33 |
| Frequency | 1.7 GHz, 250 MHz |
Memory |
|
| RAM | 1 GB / 2 GB max LPDDR4 |
| eMMC | 256 GB max |
| EEPROM | 4 KB / 32 KB max |
| SD/SDIO/MMC Interfaces | 1 |
High-Speed Interfaces |
|
| USB | 2x USB 2.0 OTG |
Peripherals |
|
| CAN | 1 |
| I2C | 1 |
| PWM | 1 |
| SPI/SSP | 1 |
| UART | 3 |
Connectivity |
|
| Ethernet | 1x 10/100 Mbps, 1x GbE (RMII) (optional RGMII with TSN Support) |
Multimedia |
|
| Display | 1x Parallel (24bpp), Optional LVDS |
| Camera | 1x MIPI CSI-2 |
| Audio | 1x SPDIF, 3x SAI |
Miscellaneous |
|
| JTAG | Yes |
| RTC | Yes |
| Security Accelerators | Secure Boot, SNVS, EdgeLock®, SRTC, TrustZone® |
| Tamper Protection | Yes |
Mechanical |
|
| Dimensions | 36 x 36 mm |
| Connector | 159-pin 1 mm pitch edge solder-down PCB |
Operating Conditions |
|
| Operating Temperature | -40° to +85° C |
| Supply Voltage | 3.3V |
| Power (Typical) | 0.80 W |
| Power (Max) | 1.62 W |
Hardware Documentation
SOM |
|
|
Hardware Manual
|
|
|
Component Placement
|
|
|
Schematic Symbol and Footprint
|
|
Carrier Board |
|
|
Component Placement
|
|
3D Model
Resources |
|
|
3D Files
SOM
|
|
|
3D Files
Carrier Board
|
|
Software
Linux |
|
|
BSP-Yocto-NXP-i.MX93-PD26.1.0
2026-03-19
|
Yocto Walnascar 5.2.2 |
|
BSP-Yocto-NXP-i.MX93-PD24.2.0
2024-10-08
|
Yocto Scarthgap 5.0 |
|
BSP-Yocto-NXP-i.MX93-PD24.1.1
2024-05-07
|
Yocto Mickledore 4.2.3 |
|
BSP-Yocto-NXP-i.MX93-ALPHA1
2023-10-05
|
BSP-Yocto-NXP-i.MX93-ALPHA1 |
Related Case Studies
Apollo Video (Luminator) – niiu Video Monitoring System
Luminator Technology Group, a leading global provider of passenger information systems, acquired Apollo Video in 2017.
iNOEX – Warp Portable
A mobile terahertz based hand-held system specifically designed for medium and large-sized extruded pipes.
Development Kits available for $299.00
Ready to get started?
Let’s go! Learn more about PHYTEC SOMs