Energy-efficient edge computing, accelerated Machine Learning
The module based on the i.MX 93 processor from NXP offers high computing power with low energy consumption. Measuring only 36 mm x 36 mm, equipped with an Arm® Ethos™-U65 microNPU and based on NXP’s innovative Energy Flex architecture, the module enables the development of powerful, cost-effective and energy-efficient ML applications, e.g. for IoT applications.
The fully industrial-grade phyCORE-i.MX 93 SOM is characterized by its price-optimized Bill of Materials. Thanks to Direct Solder Connect technology, the module is suitable for large-scale production and the manufacturing costs of the end application are significantly reduced.
The pin compatibility with the phyCORE-STM32MP13x and phyCORE-i.MX 6UL enables the development of scalable applications in terms of price/performance ratio.
Direct Solder Connect
Select exactly what you need for your application by scaling RAM up to 2GB, customizing audio and graphics requirements, plus other signal and component options. All providing a pin compatible interconnect.
|Processor||NXP i.MX 93|
|Architecture||Arm Cortex-A55 / Arm Cortex-M33|
|Frequency||1.7 GHz, 250 MHz|
|RAM||512 MB default / 2 GB max LPDDR4|
|eMMC||256 GB max|
|EEPROM||4 KB / 32 KB max|
|USB||2x USB 2.0 OTG|
|Ethernet||1x 10/100/1000 Mbps|
|Display||1x Parallel (24bpp)|
|Camera||1x MIPI CSI-2|
|Audio||1x SPDIF, 3x SAI|
|Security Accelerators||Secure Boot, SNVS, EdgeLock®, SRTC, TrustZone®|
|Dimensions||36 x 36 mm|
|Connector||1, 159-pin 3 mm pitch edge solder-down PCB|
|Operating Temperature||-40° to +85° C|
Related Case Studies
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