Safety, Security and Digital Signal Processing
52 mm x 42 mm
Tensilica® HiFi 4 DSP
4K h.265 decode
1080P h.264 encode
The phyCORE-i.MX 8X System on Module supports the NXP i.MX 8X family of applications processors. It offers efficient and scalable processing power. In addition, the Tensilica HiFi 4 DSP and GPU are available for additional acceleration and processing power. The phyCORE-i.MX 8X SOM is designed to be used for general purpose embedded control tasks with a good price-performance ratio.
The i.MX 8X Processor
The NXP i.MX 8X family of application processors provide a vast offering of solutions with respect to features and performance. The QuadXPlus, DualXPlus, and DualX platforms are based on Arm® Cortex®-A35, and Cortex-M4F.
High-density PCB interconnects
i.MX 8X interfaces are routed to our high-density PCB interconnects on the underside of the SOM. Design the mating connectors on your carrier board.
DSP and multimedia processing
The NXP i.MX 8X features a Tensilica® HiFi 4 DSP. Utilize this for advanced audio and image processing for your application. In addition to the discrete DSP the NXP i.MX 8X supports OpenGL 3.1, OpenCL 1.2 EP, OpenVG 1.1, Vulkan, 4K h.265 decode and 1080p h.264 encoding.
Software that is specifically designed for its hardware
PHYTEC Board Support Packages (BSPs) are software bundles that implement and support operating systems on our System on Modules. PHYTEC BSPs are application development-ready, offering all essential drivers and board-level feature support. The only task left for you is application integration. This way, you can focus on your core competencies while we take care of the rest.
Small footprint for small enclosures
With dimensions of 52 x 42 mm it is well suited for small enclosures.
phyCORE-AM57x SOM Tech Specs
TI Sitara AM5716/8
Ti Sitara AM5726/8
1.5 GHz / 500 MHz
C66x DSP cores
Single 3D accelerator (SGX544)
Dual 3D accelerator (SGX544)
Simultaneous Ethernet ports
45 mm x 55 mm
SOM Specification Overview