Safer and Smarter

phyCORE®-i.MX 8X

Root Part #: PCM-065

Highly reliable module for industrial automation devices.

  • 52 mm x 42 mm
  • Cortex®-A35 Cortex®-M4F
  • Tensilica® HiFi 4 DSP 2-bit 384KHz
  • Vulkan 4K h.265 decode 1080P h.264 encode

Product Overview

The phyCORE-i.MX 8X SOM is one of the few solutions on the market that provides high-level integration without compromise on cost, power consumption, or reliability. The 52×42 mm SOM supports high end features required by modern embedded applications including capabilities for 4k video streaming, dual display, dual camera, and high speed interfaces such as Gigabit Ethernet, PCIe and USB 3.0.

Released just this year, the phyCORE-i.MX 8X is expected to have continuous production until 2035+.

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Features

Reliable FD-SIO process technology

Starting at the processor, the NXP i.MX 8X series was designed with a 28 nm FD-SOI process technology. In addition, PHYTEC’s history of high quality electronic design and manufacturing delivers a highly-reliable SOM solution.

High Level of Integration

The SOM provides an all-in-one solution for graphics, video, image processing, audio, and voice functions due to the NXP i.MX 8X GPU, Tensilica® HiFi 4 DSP, real-time Cortex-M4F core.

Functionally Safe

As heavy duty machinery becomes more automated it is important to ensure the safety of factory workers who interact with the equipment. The NXP i.MX 8X includes functional safety features such as fail over mechanism for the display and camera interface, clock monitoring, and domain gateways to meet your application safety goals.

Field Replaceable

Board-to-board connectors provide a way to quickly service and diagnose units in the field allowing for system hardening if faults come up.

Specifications

Processor

Processor NXP i.MX 8DualX, NXP i.MX 8DualXPlus, NXP i.MX 8QuadXPlus
Architecture Arm Cortex-A35, Arm Cortex-M4F
Frequency 1.2 GHz

Memory

RAM 4 GB max LPDDR4
eMMC 4 GB default / 128 GB max
NAND 128 MB up to 1 GB max (optional eMMC)
NOR 64 MB up to 256 MB (Octal SPI/Dual SPI Flash)
EEPROM 4 KB
SD/SDIO/MMC Interfaces 1

High-Speed Interfaces

PCIe 1x PCIe 3.0
USB 1x USB 2.0 OTG, 1x USB 3.0 OTG

Peripherals

ADC 6
CAN 3x CAN-FD
GPIO Yes
I2C Up to 10
PWM 4
SPI/SSP 1x Octal SPI or 2x Quad SPI + 3x SPI
UART 2

Connectivity

Ethernet 2x 10/100/1000 (1x onboard / 1x RGMII)

Multimedia

Display 2x LVDS or 2x MIPI DSI, parallel
Graphics 16 Vec4-Shader GPU
Camera 1x 8-bit/10bit parallel CSI, 1x MIPI CSI
Video 1080p h.264 Encode, 4k h.265 Decode
Audio 1x ESAI

Miscellaneous

JTAG Yes
RTC Yes
Security Accelerators 3DES, AES, ECC Ciphers, RSA, SHA1/256, TRNG
Tamper Protection Yes

Mechanical

Dimensions 52 x 42 mm
Connector 2x 140-pin 0.5 mm pitch

Operating Conditions

Operating Temperature -25° to +80°C
Supply Voltage 3.3V
Power (Typical) 1.92 W
Power (Max) 3.63 W

The i.MX 8X Processor

The NXP i.MX 8X family combines multiple subsystems including Dual or Quad-core Arm Cortex-A53 cores, a real-time Cortex-M4F core, GPU, and DSP into one applications processor. The processor family is built using 28nm Fully Depleted Silicon on Insulator (FD-SOI) process technology meant for high reliability and to minimize failure rates. Additional design consideration was also provided with domain gateways, physical separation, and fail over capabilities were incorporated into the silicon to further mitigate and prevent faults.
Go to Processor Details

Hardware Documentation

SOM

Hardware Manual

L-864e.A4_phyCORE-i.MX8X_HW-Manual.pdf

Component Placement

PCM-065_1488.2_ComponentPlacement.pdf

Drawings

SOM_PCM-065_1488-2_001-Drawings.pdf

Carrier Board

Component Placement

ComponentPlacement_PCM-942_1491-2_combined.pdf

PinMux File

PCM-065_1488.2_pinmux_.1CB.xlsx

Connectors

SOM Connectors
VB410

REF-183456-XX.zip

Carrier Board Connectors
VB410

REF-183457-XX.zip

Software

BSP-Yocto-FSL-i.MX8X-PD21.1.0
Date: 2021-02-26

Yocto Zeus 3.0 (Linux kernel 5.4.24)

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