Custom Hardware

Work with our experienced staff of hardware and layout engineers on your next project from specification through fully validated PCBA.

The Phytec Difference

Expert Engineers at Your Service

PHYTEC has over 30 years of deep domain expertise in schematic capture, layout, validation, test, and other areas of microelectronic design. With an extensive library of circuitries, layout stack-ups, modular test infrastructure and other re-usable hardware blocks, we can efficiently design complex and exceptionally reliable embedded hardware. Our in-house SMT assembly and Additive Manufacturing likewise enable fast turn of custom hardware, shortening design cycles. Engage our services to accelerate development, reduce risk and achieve exacting quality in end-application hardware.

Explore Products

Custom Carrier Board Design

Offload your carrier board design to PHYTEC Engineering to receive first article prototypes quickly and reduce risk by leveraging our knowledge of the System on Module to accelerate schematic capture, PCB layout, and design verification.

The Expertise to Work as an Extension of your Team Expand All

Microprocessor Architectures

  • Arm® Cortex®-A5, A7, -A8, -A9, -A15, -A17, -A53, -A72; Cortex-M0, -M4, -M7; Classic ARM7™, ARM9™, ARM11™ (NXP/Freescale, Texas Instrument, Rockchip, Microchip/Atmel, Nordic Semiconductor)
  • Marvell (Intel) XScale
  • x86 (AMD, IBM)
  • Power Architecture® (NXP/Freescale/Motorola)
  • ColdFire® (NXP/Freescale/Motorola)
  • BlackFin® (Analog Devices)
  • TriCore™ (Infineon)
  • 8- and 16-bit microcontrollers (Infineon/Siemens, NXP/Philips)

Circuitries and Interfaces

  • DSPs, FPGAs, PLDs, glue logic, security chipsets, RTCs, Power Management
  • Memory and Storage: SSD, SATA, Nor-Flash, Nand-Flash, SPI-Flash, SDRAM, DDR4, SD/SDIO/MMC
  • Multimedia: Audio, Video, Camera
  • HMI: LCD, MIPI, CSI, LVDS, HDMI, DVI, Keypad, ePaper Displays (EPD)
  • Connectivity: USB, Ethernet, CAN, Bluetooth, WiFi, PCle, SATA
  • Serial: UART, SPI, I2C GPIO, A/D, D/A, and analog
  • Sensors and Actuators: Time of Flight (ToF); magnetometers; accelerometers; IR-thermopiles; humidity, light and other sensors
  • Embedded Vision: CMOS sensors, thermal cameras and other digital camera technology
  • Power: Power management; Reverse voltage protection; ESD and transient protection; Power Isolation; Power over Ethernet; Design for Automotive, Aircraft, or Military standards compliance

Schematic Capture

  • Low EMI design
  • Advanced Power management
  • Junction temperature sensing and thermal management

PCB Layout

  • Mixed speed and signal technology
  • High-speed digital and analog design
  • Low EMI/RFI design
  • μBGA, dual-die, fine pitch, PoP (package-on-package), microvias PCB technology, passive components as small as 01005 inch (0402 metric) packaging
  • Power rail separation, Power over Hours (PoH) analysis
  • High-density, multi-layer (12+), small form factor PCBs
  • Signal integrity analysis
  • Advanced simulation, 3D modeling and pre-compliance testing

Design Tools

  • Mentor Graphics DxDesigner and Xpedition PCB, HyperLynx Signal Integrity
  • Altium Designer/Protel
  • Over 20,000 part CAD library
  • Mentor Xpedition 3D Layout, SolidWorks 3D CAD/CAE
  • Re-usable schematic blocks, including layout stack-ups, to accelerate hardware design

Printed Circuit Board Assembly (PCBA) Form Factor Options

  • System on Modules / Computer on Modules (SOMs / COMs) CPU subassemblies with Direct Solder Connect (DSC) or board-to-board connections (Samtec, Molex) to target hardware
  • Carrier Boards for break-out of I/O from SOMs
  • Single Board Computers: either as a SOM/Carrier Board combination or as a “flat design” with CPU and interface circuitry and connectors on a single PCB

In-House Engineering and Manufacturing Symbiosis

  • Design for Manufacturability (DfM) and Design for Test (DfT) optimization through close engineering and manufacturing collaboration
  • Component engineers select materials according to DfM principles, longevity, availability, reliability, cost, process and supply chain considerations
  • Common Data Exchange Engineering and Manufacturing: Bills of Material, CAD design data
  • Rapid Prototyping, Customization, Design Iterations: in-house High Mix Low Volume (HMLV) manufacturing drives rapid prototyping, product customization; rapid design iterations = “First Time Right” designs upon release to market and ramp to mass production; avoidance of costly design revisions and DfM delays following product launch
  • Agile Methodology: Engineering and Manufacturing under one roof cultivates rapid reaction to changing market conditions and constraints; early adoption of new technology innovations; continuous process control feedback between manufacturing and engineering

Extensive Design Verification

  • Simulation
  • Voltage, Current, Power, Timing, Signal Integrity and EMI Measurement
  • Functional Operation
  • Temp Chamber Stability Testing
  • PCBA Microsection Analysis including PCB stack-up, solder mask and cross sectional metallographic and microscopic examination
  • HALT (Highly Accelerated Life Test) stress testing for revealing of product failure modes
  • Radiated Emission, Conducted Emissions and Radiated Immunity Testing in compliance with FCC Part 15, EN55011, EN55022, CISPR11, CISPR22, and CISPR32
  • MTBF (Mean Time Between Failures) predictive performance and error probability calculations
  • Additional stress / resilience testing for hardware, storage media and software upon request


  • Hardware design practices that incorporate testability features in PCBA design: JTAG + boundary scan, voltage, current, and signal test points
  • Production test: electrical, functional, boundary scan; proprietary and modular test framework for rapid test adaptation
  • Bed of nail, press fit, spring probe and clam shell clamping fixture design

Advanced Rework Capabilities: ERSA HR550 Rework Station

  • High-performance hybrid heating element and high-precision vacuum pipette allows rework of BGA and other advanced SMT package devices
  • Enables fast and easy modification of hardware for Product Change Notice (PCN), configuration customization, or other validation purposes

3D Printing

  • Prototype housing
  • Rapid-turn of alignment jigs, tooling, prototype mechanical parts, physical / build envelopes

Qualifications & Standards

  • Dedicated team to monitor component-level Product Change Notifications (PCNs), locate second source options and ensure continued availability of pin- and function-compatible SOMs and other PCBAs
  • Pro-active Product Lifecycle Management (PLM) policy has sustained PHYTEC products for over 25 years
  • Transparent version control of any form, fit or function impact to a hardware design

See why others trust Phytec products

PHYTEC handled all developments that we partnered on very professionally. The team is flexible, fast and definitively a phenomenal partner for us. When working with a development partner, we find it important that the developers get along well. Working with PHYTEC has been a positive experience all around.

When using the Board Support Package for the System on Module that we used, I was impressed how up to date the Linux Mainline Kernel was. Whenever I had technical questions, I received a quick and competent answer from the support team. PHYTEC’s documentation was also very extensive.

When we started working with PHYTEC to implement Linux-based, form-fit embedded solutions in 2009, we were impressed with PHYTEC’s hardware and software expertise from the very beginning. PHYTEC has become a trusted partner for Belimo and we have since carried out multiple projects together.

As the market leader for smartcard-controlled training systems, we need professional partners that we can rely on for development of our premium products. We have found an ideal partner in PHYTEC. PHYTEC, with its flexible working approach, has already supported us throughout the conceptual phase. This particularly applies to adherence to delivery dates. We were able to benefit from PHYTEC’s extensive experience during the commissioning of the first prototypes. They were able to accommodate final requests for changes easily and promptly implemented them due to the manufacturing facility in Germany.

The pleasant working relationship and comprehensive support enabled target-oriented and professional cooperation. This is important because if you want to set standards, you cannot accept compromises

The collaboration with PHYTEC helped us carry out a technically complex development project with a comparatively small development team within a very short time period. The phyCORE SOM and a Development Kit enabled us to quickly develop a first prototype. For series production, we will use a baseboard that has been designed especially for us. In retrospect, I think that the combination of PHYYTEC hardware and software know-how was of great value to us

At Groeneveld ICT Solutions, we want to offer our customers the very best solutions. Therefore, we require the same from our suppliers. PHYTEC is capable of delivering high quality solutions. Moreover, we’ve experienced that they have the same philosophy as Groeneveld – customers first and only the best possible products. These are the two main reasons why we have chosen PHYTEC as a partner.

Phytec’s expertise in electronics, software and mechanics ideally complements our in-house skill set. We currently work together on the fourth generation IVU device. With Phytec we have found an innovative partner that is able to develop cutting-edge products that meet various market requirements.

The CPU solution from PHYTEC is an important part of our charging controller, which is installed in chargeIT mobility intelligent charging boxes. These devices map vehicle, user and IT back-end communication cost-effectively, dynamically adjust the performance and control the exchange of information between several charging points. For this important component we need an experienced and reliable supplier, which we found in PHYTEC. The network of charging stations for electric vehicles is constantly being expanded. Electric mobility is gaining in importance, and with it intelligent charging, which is possible with our charging controller and the integrated processor from PHYTEC.

Customer Case Studies

Browse our library of customer case studies to see how PHYTEC Products are used in the field.

Technical Support

Extensive Product Support complements our hardware design and includes schematic review and engineering consulting.

Quality and Long Term Availability

Expertise in Quality Assurance and Product Lifecycle Maintenance bolster our engineering and manufacturing services.

Ready to get started?

Get in touch with our technical team to discuss your project and get started on your next design.