Manufacturing Compliance and Certifications
- ISO9001:2015
- RoHS II(IPC 1752-A Full Material Declaration available upon request)
- REACH
- WEEE
- Conflict Minerals
- IPC-600A-F class 2, 3 Acceptability of Printed Boards
- IPC-610A-D class 2 Acceptability of Electronic Assemblies (class 3 available upon request)
- IPC TM-650 Test Methods
- J-STD-004 (ROL0) “No-Clean” Requirements for Soldering Paste and Fluxes
Industry Compliance and Certifications
- VDA2 (Verband der Automobilindustrie) German Association of the Automotive Industry
- KTA 1401 (Kerntechnischer Ausschuss) Nuclear Safety Standards Commission
- IEC 61508 Functional Safety of Electrical/Electronic/Programmable Electronic Safety-related Systems
- EU Radio Equipment Directive (RED) and predecessor Radio and Telecommunication Terminal Equipment (R&TTE) directive
- E1 German Federal Motor Transport Authority (KBA, Kraftfahrtbundesamt) quality assurance mark standards
- UL and additional conformances and tests upon request
- CE/FCC Conformance
Extensive Design Validation
- Simulation
- Voltage, Current, Power, Timing, Signal Integrity and EMI Measurement
- Functional Operation
- Temp Chamber Stability Testing
- PCBA Microsection Analysis including PCB stack-up, solder mask and cross sectional metallographic and microscopic examination
- Dye-and-pry: destructive analysis technique and application of dye penetrant inspection to inspect for solder joint integrity
- HALT (Highly Accelerated Life Test) stress testing for revealing of product failure modes
- Radiated Emission, Conducted Emissions and Radiated Immunity Testing
- FMEA (Failure Mode and Effects Analysis) and MTBF (Mean Time Between Failures) predictive performance and error probability calculations
- Additional stress / resilience testing for hardware, storage media and software upon request
In-Process Production Monitoring
Standard in-line production process control includes:
- In-line and off-line Solder Paste Inspection (SPI)
- 2D Datamatrix codes applied to top and bottom sides of all work-in-process Printed Circuit Board Assemblies (PCBAs), enabling 100% traceability and identification of products and production orders throughout all steps of the production process, including intermediate test results
- Automated Optical Inspection (AOI) and manual visual inspection
Production Test
All units are provided with a unique serial number upon passing of the following tests, with production test results used as feedback for continuous production process control:
- Boundary Scan
- Automated Optical Inspection (AOI), manual visual inspection, X-ray as applicable
- Functional operation within PHYTEC proprietary framework for the accelerated implementation of function tests
- All test results logged in a MySQL database providing 100% traceability and itemization of individual functional test results (100% traceability to individual component-level is available upon request)
- Production and Field Yield > 99.5% at volume production
PHYTEC’s quality program includes pro-active and comprehensive Product Lifecycle Management by a team dedicated to ensuring long-term sustainability of PHYTEC products.
Need more information?
Please contact PHYTEC’s sales team or call 800.278.9913 for additional information or to request a copy of any specific quality documentation