phyFLEX®-AM62L
Efficient industrial compute with rich connectivity and long-term reliability.
Product Overview
Designed for cost-sensitive and low-power industrial IoT applications where efficiency and reliability are critical. Built on TI AM62Lx processors within the FPSC standard footprint for scalable embedded design.
The phyFLEX®-AM62Lx is a low power AM62Lx SOM designed for embedded development, helping engineering teams move from evaluation to production faster. By integrating processing, memory, and essential interfaces into a production-ready module, it removes the complexity of designing processor-based hardware from scratch.
For cost-sensitive or power-constrained systems, this module delivers the required performance without unnecessary overhead. This reduces BOM cost, simplifies thermal design, and improves long-term system reliability.
Built for the FPSC standard footprint, the phyFLEX-AM62Lx enables pin-compatible scalability across the phyFLEX SOM family. This allows engineers to adapt or upgrade designs without redesigning the baseboard. This enables engineering teams to reduce development risk, simplify integration, and accelerate time to market.
Contact Sales for more information about this product or early-release development kits.
When to Choose an AM62Lx System On Module
Choose this module if your application requires:
- Low power consumption for energy-efficient designs
- Cost-optimised hardware for scalable deployments
- Reliable processing for control systems, IoT devices, and industrial applications
- A future proof, scalable SOM platform with pin-compatible upgrade paths
Typical applications include:
- Industrial control systems
- Building automation
- Smart sensors and gateways
- Entry-level HMIs
Development and Integration Benefits
- FPSC standard footprint for scalable SOM design
- Development kits for rapid evaluation and prototyping
- Board Support Packages and software support
- Direct access to embedded engineering expertise
- Designed for long-term industrial deployment, including CRA readiness considerations
Features
Low Cost
Best price-performance ratio with tiered prices
Low Power
Ideal for battery-powered devices and enables fanless designs
FPSC
Scalable and pin compatible with all FPSC SOMs
Compact and Robust
Vibration and shock resistant, 6-layer carrier boards possible
Specifications
Processor |
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| Processor | TI AM62Lx |
| Architecture | Arm Cortex-A53 |
| Frequency | Up to 1.25 GHz |
| Co-Processors | |
Memory |
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| RAM | 512 MB / 4 GB Max DDR4 |
| eMMC | 4GB / 256 GB max |
| EEPROM | 4 KB / 32 KB max |
| SD/SDIO/MMC Interfaces | Up to 2 |
High-Speed Interfaces |
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| USB | 2x USB2.0 (all dual-role) |
Peripherals |
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| CAN | Up to 3x CAN FD |
| eCAP | Up to 3 |
| eQEP | Up to 3 |
| I2C | 4 / 5 Max |
| PWM | Up to 3 |
| SPI/SSP | 3x (+1x OSPI) / 4x (+1x OSPI) Max |
| UART | 3x / 8x Max |
Connectivity |
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| Ethernet | 2x Gigabit (1x on-board PHY/ 1x RGMII, all with TSN and AVB) |
Multimedia |
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| Audio | 1x McASP / 3x McASP Max |
| Display | MIPI DSI (4-lane) or LVDS or DPI (24-bit) |
| ADC | Up to 4 (10-bit) |
Miscellaneous |
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| JTAG | Yes |
| RTC | Yes |
| Security Accelerators | AES-128, AES-256, DRBG, PKE, SHA 224, SHA 512, SM4 |
Mechanical |
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| Dimensions | 37 mm x 38 mm |
| Connector | 1.27 mm pitch, Fused Tin Grid Array (FTGA) |
Operating Conditions |
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| Operating Temperature | -40 to 85°C Industrial |
| Power (Max) | TBD |
| Power (Typical) | TBD |
| Supply Voltage | 5.0V |
Hardware Documentation
SOM |
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Hardware Manual
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Component Placement
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Schematic Symbol and Footprint
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Carrier Board |
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Component Placement
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PHYTEC PinMux Tool
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The AM62Lx Processor
The AM62Lx Sitara® processor from Texas Instruments is built for efficient, high-performance industrial and embedded applications. Featuring dual Arm® Cortex®-A53 cores running at up to 1.25 GHz. It supports a broad range of connectivity options, including dual Ethernet, USB 2.0, and multiple CAN FD interfaces making it well-suited for factory and building automation systems. With integrated hardware security features such as Secure Boot, Trusted Execution Environment (TEE), and Arm TrustZone®, and designed for operation in harsh temperature environments, it provides a secure and reliable foundation for long-life designs.
3D Model
Resources |
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3D Files
SOM
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3D Files
Carrier Board
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Software
Linux |
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BSP-Yocto-Ampliphy-AM62Lx-ALPHA2
Date: 2025-07-17
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Yocto Scarthgap 5.0.10 (Linux 6.12.33, U-Boot 2025.01) |
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