High quality and phenomenal reliability in electronic manufacturing. Customize your SOM or build your carrier board using PHYTEC manufacturing services that have an annual production throughput of nearly one million Printed Circuit Board Assemblies (PCBAs) at our in-house plant and partner facilities.

The PHYTEC Difference

In-house manufacturing

We provide customization, even at low volumes, using our in-house production capabilities at PHYTEC Headquarters in Mainz, Germany. Our internal manufacturing equipment, ISO9001-certified processes, optimized component purchasing, and Enterprise Resource Planning (ERP) system enable us to cost-effectively and flexibly manage High Mix, Low-to-Medium Volume (HMLV) manufacturing. This HMLV approach supports our wide product palette and meets the delivery demands and customization requirements of our diverse customer base.

HMLV efficiency is achieved through aggregated kitting, production set-up, and feeder loading around common products. This includes numerous configurations of SOMs based on the same microprocessor and products that otherwise share over 90% of components. HMLV manufacturing optimizes production throughput while minimizing feeder replacement, set-up, and line change idleness.

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Production Partners

Through partnerships with external production facilities we enable further cost-optimization and scalability for high volume PCBA production up to 100,000 units a year.

In-House Surface Mount Technology (SMT) Production Expand All

Solder Paste Printing

  • 6x fully automatic Solder Screen and Stencil Printers with built-in stencil cleaning paste and 2½ D visual inspection
    • 4x Ekra X4
    • 2x Ekra X5
  • 1x Pre-Solder Automated Optical Inspection (AOI)
    • 1x Viscom S3088 AV offline AOI
  • 5x Solder Paste Inspection (SPI) Systems, in-line and off-line
    • 4x Kohyoung Aspire in-line SPI
    • 1x Kohyoung KY-3020T off-line SPI
  • 2x Liquid Dispensing Systems
    • 1x Camalot 1818: up to 16,000 dots of solder paste or SMD epoxy per hour
    • 1x In-line Asymtek

Parts Placement (Advanced Pick and Place)

  • 6x Pick and Place SMT Lines (11x machines): Hanwha Techwin (formerly Samsung C&T Automation)
    • Line 00 (prototype): 1x SM421 with nominal loading capacity of up to 30,000 CPH (components per hour placement) per IPC 8950
    • Line 01: 1x SM411, 1x SM421 with 45,000 CPH
    • Line 02: 1x SM471, 1x SM421 with 50,000 CPH
    • Line 03: 1x SM471, 1x SM482 with 50,000 CPH
    • Line 04: 1x SM471, 1x SM482plus with 55,000 CPH
    • Line 05: 1x SM471plus, 1x SM482plus with 60,000 CPH
    • Automatic traceability for all reel components, other components with additional efforts on demand

Soldering (Vapor Phase)

  • 8x Vapor Phase Reflow Soldering Systems
    • 4x ASSCON VP-2000 inline soldering system configured for lead-free solder (230 ˚C Galden medium), 1 of which are double-track
    • 1x ASSCON VP-3000 inline soldering system configured for lead-free solder (230 ˚C Galden medium)
    • 1x ASSCON VP-64 batch soldering system configured for lead-free solder (230 ˚C Galden medium)
    • 1x ASSCON VP-56 batch soldering system configured for lead-free solder (230 ˚C Galden medium)
    • 1x ASSCON VP-53 batch soldering system configured for leaded solder process (200 ˚C Galden medium)
  • 2x Automated Post-Solder Automatic Optical Inspection (AOI) Systems, with 100% sample rate
    • 1x Kohyoung Zenith 3D system, 100% 3D measurement of components and solder joints, real analysis of measured data
    • 1x Viscom S3088 Ultra with 1x orthogonal and 4x oblique cameras. Each solder joint is checked for solder paste printing, short circuit, cold solder joints, tombstones, reverse polarity and shift

Capacity and Component Capabilities

  • SMT capacity: placement of 200+ million chips per year at HMLV production
  • Fine-pitch IC: min 0.03 mm
  • BGA, microBGA, CSP, Flip Chip and Package on Package (PoP):
  • Minimum ball pitch: 0.40 mm
  • Minimum ball dimensions: 0.40 mm
  • Maximum PCB size: 510 mm x 460 mm
  • Component Size (smallest): to 01005 (inch) / 0402 (metric)

Through Hole Technology (THT) Production

  • Selective Soldering
    • 2x Zipatec Select 250 with selective solder pot changes for conventional solder and lead-free SAC solder
    • 1x Zipatec Select 460
  • Wave Soldering
    • 1x ERSA EWS-330 with spray fluxer
    • 1x ERSA PowerFlow with spray fluxer
    • Systems with nitrogen and configured for lead-free SAC solder


  • 1x Phoenix microme|x 180 X-ray system.  A dynamically calculated sampling rate of all hardware is x-rayed for identification of missing of fillets, pores and voids, solder, and icicling
    • Maximum inspection area of 610 x 560 mm, detail detectability of 1μ and maximum tube voltage of 180 kV / 20 W
    • Automatic calculation of pore structures for multichip
    • Oblique 0˚ – 70˚, rotation 0˚ – 360˚
  • 1x HAWKEYE 1000 X-ray component counter, inspection of 01005 components up to large connectors, HQ X-ray detector with 6.9MP, counting accuracy >99.9%

Test and Traceability

  • In Process: Standard in-line production process control includes:
    • in-line and off-line Solder Paste Inspection (SPI)
    • 2D Datamatrix codes applied to top and bottom sides of all work-in-process Printed Circuit Board Assemblies (PCBAs), enabling 100% traceability and identification of product and production orders throughout all steps of the production process, including intermediate test results
    • AOI and manual visual inspection
  • Final Test: PHYTEC offers 100% traceability in a MySQL test result database, including itemization of individual functional test results.  All units are provided with a unique serial number upon passing of the following tests:
    • Boundary Scan
    • Göpel proprietary framework for functional testing, including voltage and current measurements

Additive Manufacturing and Additional Services

  • Box Build: electromechanical assembly of Printed Circuit Board Assemblies (PCBAs) within enclosures, including connectivity to user interface displays, installation of sub-assemblies, routing of cabling or wire harnesses, and fabrication of enclosures
  • Additive Manufacturing and Enclosure Design
    • DragonFly Lights-Out Digital Manufacturing (LDM) system and DragonFly 2020 Pro 3D Printer with precise inkjet deposition system for print of electronic circuits such as Printed Circuit Boards (PCBs), antennas, capacitors and sensors
    • Statasys PolyJet 3D Print capabilities
    • Solidworks: 3D modeling
  • Advanced Rework Capabilities
    • Kurtz Ersa HR 550 Hybrid Rework Systems
  • Conformal Coating
    • Acrylic: HumiSeal 1B73 and other coatings upon request
    • Silicone: upon request

Quality Control

PHYTEC’s internal quality control program encompasses all material, labor, and production inputs.

Supply Chain

PHYTEC’s 35 years of expertise in System on Module and embedded technology is matched by a strong commitment to Supply Chain Continuity and cost optimization.

Hardware Design Services

Work with our experienced staff of hardware and layout engineers on your next project for design and production.

Contact Form

Get in touch with our technical team to discuss your project and specifications.