phyBOARD®-i.MX 8M Mini
Versatile module for a wide range of embedded applications.
Product Overview
The phyBOARD-Polis, either a development platform for the phyCORE-i.MX 8M Mini/Nano, or a powerful, industry-compatible single-board computer for immediate implementation of your product idea. As a development platform, the phyBOARD-Polis serves as reference design for your customer-specific application and enables parallel development of the software and carrier board for the phyCORE-i.MX 8M Mini/Nano. A modern FTDI interface allows software download and debugging. As a powerful, industrial single-board computer (SBC), the phyBOARD-Polis is equipped with a variety of standard interfaces which are available on standard or socket/pin header connectors, while interesting extensions of the phyCORE-i.MX 8M Mini/Nano features such as CAN FD, WLAN and an integrated TPM chip further extend the range of applications that can be developed with the phyCORE-i.MX 8M Mini/Nano.
Features
No connector BGA SOM footprint
The phyCORE-i.MX 8M Mini features PHYTEC Ball Grid Array (BGA) SOM technology. Instead of connectors, the SOM uses a BGA to interface with the carrier board. BGA technology allows for reduced system cost due to no connector requirement and allows for a a lower profile enclosure. PHYTEC offers a layout footprint and services to assist in integrating this BGA SOM into custom carrier board designs.
Powerful Multimedia
The i.MX 8M Mini is focused on media support with audio sampling up to 32-bit at 384KHz, DSD512 and TDM support. In addition, the module supports video decoding 1080p60 resolution on the MIPI-DSI (4-lanes) interface with discrete independent 2D and 3D GPU engines. Playback the latest video standards up to 1080p resolution using H.264, H.265 and VP9 (for YouTube) codecs.
Security
The phyCORE-i.MX 8M Mini supports High Assurance Boot (HAB), Secure non-volatile Storage (SNVS), and a Cryptographic Acceleration and Assurance Module (CAAM). These systems, together, allow for secure boot and secure operation of software.
Fan-less operation and small footprint
With dimensions of 40 mm x 37 mm and a low-profile BGA footprint the phyCORE-i.MX 8M Mini is well suited for small enclosures. In addition, NXP has engineered the i.MX 8M Mini processor to be optimized for fan-less operation, low thermal system cost, and long battery life.
Specifications
System On Module |
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System on Module | phyCORE-i.MX 8M Mini |
Memory |
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SD/SDIO/MMC Interfaces | 1x microSD Connector |
High-Speed Interfaces |
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PCIe | 1x Mini PCIe Connector |
USB | 1x Micro-AB Connector, 1x USB-A High Speed Connector |
Peripherals |
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CAN | 2x5 Header |
RS-232 | 2x5 Header |
Connectivity |
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Bluetooth | BLE 4.2 |
Ethernet | 1x 10/100/1000 Mbps RJ45 |
WiFi | 802.11b/g/n |
Multimedia |
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Display | MIPI DSI or FlatLink LVDS via A/V connector |
Camera | 1x MIPI CSI-2 (phyCAM-M) |
Audio | SAI via A/V Connector, Voice Array Connector |
Miscellaneous |
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Battery | Gold Capacitor |
RTC | Yes |
Mechanical |
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Dimensions | 100 x 100 mm |
Operating Conditions |
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Operating Temperature | -40° to +85° C |
Supply Voltage | 12-24V |
The i.MX 8M Mini Processor
The NXP i.MX 8M Mini family of applications processors bring the power of up to four 1.8 GHz arm Cortex®-A53 processors to a small and efficient package. Gigabit ethernet and PCIe 2.0 allow for high-throughout expandablility.
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