Intelligence at the Edge

phyFLEX®-i.MX 8M Plus

Root Part #: PFL-G-01

FPSC form factor for pin-compatible phyFLEX SOMs

  • 40 mm x 37 mm
  • Cortex®-A53 Cortex®-M7
  • NPU Neural Processing Unit
  • LVDS, MIPI DSI-2, HDMI

Product Overview

The NXP i.MX 8M Plus processor family brings powerful application processing, AI acceleration, graphics, multimedia, and connectivity to embedded systems. With up to four Arm® Cortex®-A53 cores, a Cortex®-M7 real-time processor, 2.3 TOPS NPU, ISP, and dedicated graphics and video acceleration, the platform is well suited for intelligent edge applications that combine vision, processing, and real-time control.

The phyFLEX®-i.MX 8M Plus brings these capabilities together in a compact, production-ready SOM. Built on the standard FPSC footprint, the module provides a flexible foundation for integrating the i.MX 8M Plus into industrial and embedded products while reducing the hardware development required to get from processor to production.

With integrated AI acceleration, camera and display support, industrial connectivity, and real-time processing on a single module, the phyFLEX-i.MX 8M Plus is well suited for applications such as machine vision, intelligent HMIs, industrial automation, robotics, and edge AI. The standardized FPSC footprint also allows compatible phyFLEX modules to share carrier-board designs, giving developers more flexibility as products and processing requirements evolve.

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Features

Run AI at the Edge

The integrated 2.3 TOPS NPU provides hardware acceleration for machine learning workloads, allowing applications to run inference directly on the SOM. Combined with the i.MX 8M Plus ISP and multimedia capabilities, the module is well suited for applications such as object detection, image classification, and intelligent video processing.

Built for Vision Applications

The i.MX 8M Plus combines an integrated image signal processor with dedicated graphics and video acceleration. Connect cameras through MIPI CSI-2 and displays through MIPI DSI, LVDS, or HDMI for applications ranging from machine vision and inspection to advanced industrial HMIs.

Industrial Connectivity

Dual Gigabit Ethernet with TSN, along with PCIe 3.0, USB 3.0/2.0, CAN FD, UART, I²C, and SPI provide the connectivity needed for industrial systems. The integrated Cortex®-M7 can also handle real-time control and communication tasks alongside Linux applications running on the Cortex-A53 cores.

Flexibility for Your Product

The FPSC standard footprint makes it possible to use compatible phyFLEX modules with a common carrier-board design. This gives developers more flexibility when creating product variants or adapting their design to changing processing requirements, without having to redesign the carrier board from the ground up.

Specifications

Processor

Processor NXP i.MX 8QuadPlus
Architecture Arm Cortex-A53, Arm Cortex-M7
Frequency 1.8 GHz (per core) / 800 MHz

Memory

RAM 256 MB - 8 GB LPDDR4
eMMC 8 GB default / 64 GB max
NOR 4 MB up to 256 MB Quad SPI Flash
EEPROM 4 KB
SD/SDIO/MMC Interfaces 3x (1x reserved for eMMC)

High-Speed Interfaces

PCIe 1x PCIe 3.0
USB 2x USB 3.0 / 2.0 OTG

Peripherals

CAN 2x CAN FD
GPIO Yes
ADC Up to 4 (10-bit)
I2C 3
PWM 4
SPI/SSP 3x ECSPI
UART 4

Connectivity

Ethernet 2x 10/100/1000 Mbps (TSN Support)

Multimedia

Display 1x HDMI, 1x MIPI DSI-2, 2x LVDS
Graphics 2D GPU (Vivante GC520L), 3D GPU (Vivante GC7000UL)
Camera 2x MIPI CSI-2
Audio SAI, SPDIF, I2S, AC97, TDM
Video Decode - 1080p60 H.264, H.265, VP8, VP9, Encode - 1080p60 H.264, H.265

Miscellaneous

JTAG Yes
RTC Yes
Security Accelerators 3DES, AES, CAAM, DES, DRM, EEC, PKHA, RDC, RNG, RTIC

Mechanical

Dimensions 40 mm x 37 mm
Connector 1.27 mm pitch, FPSC-Gamma, Fused Tin Grid Array (FTGA)

Operating Conditions

Operating Temperature -40° to +85° C
Supply Voltage 5.0V
Power (Typical) 1.81 W
Power (Max) 3.72 W

Hardware Documentation

SOM

Hardware Manual

phyFLEX-i.MX8M Plus Hardware Manual

Component Placement

phyFLEX-i.MX8M Plus Component Placement

Schematic Symbol and Footprint

Coming Soon!

Carrier Board

Component Placement

phyFLEX-Libra  Component Placement Diagram 

PHYTEC PinMux Tool

Coming Soon!

3D Model

Sketch-fab model, Coming Soon

Resources

3D Files
SOM

phyFLEX-i.MX8M Plus STEP Models

3D Files
Carrier Board

phyFLEX-Libra STEP Models

The i.MX 8M Plus Processor

The NXP i.MX 8M Plus family of application processors revolutionizes edge computing by integrating on-chip machine learning accelerators. The dual or quad Arm Cortex-A53 and real-time Cortex-M7 cores are complemented by NXPs Neural Processing Unit (NPU) operating at 2.3 TOPS for fast response time of machine learning algorithms. In addition 1080p60, h.265/4, VP9, VP8 video decode, 1080p60, h.265/4 encode, dedicated Dual Image Signal Processor (ISPs) with resolution up to 12MP, 3D/2D graphics acceleration, advanced audio, and Cadence® Tensilica® HiFi 4 DSP @ 800 MHz for low power voice acceleration are features that support machine vision as well as audio and voice capabilities.

Go to Processor Details

Software

Linux

BSP-Yocto-NXP-i.MX8MP-FPSC-ALPHA1
Date: 2025-08-11

Yocto Scarthgap 5.0.11

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