phyBOARD®-STM32MP25x FPSC Development Kit

Product Overview

The embedded development kit features the phyCORE-STM32MP25x FPSC-Gamma module designed within PHYTEC’s FPSC (Future Proof Solder Core) standard. The phyFLEX-STM32MP25x SOM solders directly onto the carrier board like a chip, delivering a future-proof upgrade path across the entire phyFLEX family without requiring a board redesign.

Within this compact footprint, the phyFLEX-STM32MP2x brings enterprise-grade connectivity to the edge, including three 1Gbit TSN Ethernet ports with an integrated switch, USB 3.0 SuperSpeed, PCIe Gen 2, and rich multimedia support with MIPI CSI-2, DSI-2, and dual LVDS display outputs. With up to 4 GB LPDDR4, up to 256 GB eMMC, on-board power management, and a low-EMI multi-layer design, it’s built for demanding industrial, medical, and IoT applications where reliability and longevity matter.

PHYTEC backs the phyFLEX-STM32MP2x with a production-ready Yocto BSP, modular device tree overlays, and comprehensive design services — so your team can focus on the application, not the platform.

Contact Sales for more information about FPSC and this product.