Germany
France
Europe
Production Facilities
PHYTEC's current production throughput is approximately 100,000 SOM and other hardware assemblies annually. Our ISO 9001-certified in-house facility enables us to cost-effectively and flexibly manage high-mix, low-to-medium volume (HMLV) manufacturing. This HMLV approach best supports our wide product palette, as well as best meets the delivery demands, quality requirements and customization needs of our diverse customer base.
Our manufacturing equipment, processes, cost model and Enterprise Resource Planning (ERP) system are designed to meet the challenges of a high-mix, low-to-medium volume production. Personnel are specifically trained for SMD, through-hole, inspection and test functions of our production process. PHYTEC is committed to consistently high quality assurance for all production runs, whether small production batches numbering in the dozens to volume output of thousands of units.
| Manufacturing Equipment | ||
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Ekra E5 solder printers We have two fully automated Ekra solder printers with Manual Optical Positioning Systems with integrated stencil cleaning (wet, dry, vaccum) and 2½D solder paste inspection.
Fully-automated SMD component placer machines:
Vapor phase soldering systems:
Ersa EWS-330 wave solder systems We have two Ersa EWS-330 wave solder systems with integrated spray fluxers, one of which supports residual oxygen monitoring and control as well as provides a titanium-nozzle for RoHS-compliant lead-free solder processes.
ZipaTec Select 250 Off-Line Selective Soldering System Our ZipaTec Select 250 Off-Line Selective Soldering System has interchangeable nozzles for leaded or RoHS-compliant lead-free soldering processes.
Viscom S6034 Automated Optical Inspection (AOI) system All production units are subject to our Viscom S6034 Automated Optical Inspection (AOI) system with orthogonal and 4x diagonal cameras. |
Ekra E5 Solder Paste Printer
Samsung SMD Placement Machinery
Vapor Phase Solder
Automated Optical Inspection |
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| Production Processes | ||
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Advanced, dual-sided SMD assembly of miniature 0402, μBGA and Microvias components. Traditional THT (Through Hole Technology) supported by our wave solder machinery, as is mixed production using SMD and THT components. No-Clean processes per J-STD-004 standards. AOI and manual visual inspection of all hardware following assembly. Functional, electrical and (if applicable) Boundary Scan test of all hardware following assembly, with unique serialization of all units that pass test. |
Visual Inspection
Boundary Scan |
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| Certification and Conformance Standards | |
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PHYTEC's internal quality control program encompasses all material, labor and production inputs. Learn more » |
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