The PHYTEC Advantage

Shorten Time-to-Market & Reduce Risk in all Phases of Development

PHYTEC Single Board Computer (SBC) modules support you in every stage of embedded design: from evaluation and prototyping to development and OEM deployment. 

Our SBCs can be used at various levels of end user deployment, scaled to volume requirements:

• Buy an SBC module, design it into your own carrier board target hardware (low to mid volumes)
• Buy an SBC module, have PHYTEC design and manufacture a custom carrier board (mid to high volumes)
• Have PHYTEC develop and build a "flat" design that re-uses and integrates our SBC circuitry and target board circuitry on a single PCB (high volume)

Implementation of an OEM-able SBC subassembly as the "core" of your embedded design allows you to focus on hardware peripherals and firmware without expending resources to "re-invent" microcontroller circuitry. Furthermore, much of the value of the phyCORE module lies in its layout and test.

Production-ready Board Support Packages (BSPs) and Design Services for our hardware further reduce development time and expenses. Take advantage of PHYTEC products to shorten time-to-market, reduce development costs, and avoid substantial design issues and risks.

Let PHYTEC Help You Reduce Time-To-Market & Costs In All Stages Of Embedded Design:

1. Evaluation & Start-Up
2. Development
3. Integrated Support Services
4. OEM Deployment

 

1

Your Design Phase: Evaluation & Start-Up

How PHYTEC Can Help

PHYTEC SBC modules and Rapid Development Kits support a wide variety of embedded processors, in particular 32-bit ARM, XScale, PowerPC, ColdFire and Blackfin devices.

Single Board Computer modules: PHYTEC SBC modules incorporate essential circuitry common to all embedded applications. In this circuitry, a microprocessor interfaces to devices such as SRAM, Flash memory and communication transceivers.  Depending on supported processor resources, our SBC subassemblies provide voltage regulation, voltage supervision, processor independent watchdog supervision, programmable logic, Ethernet MACs and PHYs, USB and other commonly-used peripherals… all in a compact form factor, multi-layer PCB with enhanced EMI protection.

Rapid Development Kits: phyCORE modules are designed to be plugged onto applicable Carrier Boards.  Both the module and Carrier Board are included in PHYTEC Rapid Development Kits.  The Carrier Board contains the I/O connectors required for immediate start-up of the module, as well as other interface circuitry not provided on the SBC module itself.  The SBC, when mounted on the Carrier Board, provides an excellent platform with which to evaluate controllers, develop software, as well as specify and determine the feasibility of new embedded designs.

Development Tools & Operating Systems:  A PHYTEC Spectrum CD-ROM is included in all Rapid Development Kits.  This CD offers complete electronic documentation and demo programs. Evaluation versions of third party development tools from such companies as IAR, Keil, Freescale CodeWarrior and Microsoft are also included in the kits.  Following start-up of kit hardware, use these software tools to create your own code for download to the SBC module.  For SBCs that support an operating system, demo images and Board Support Packages (BSPs) for Windows Embedded CE and Linux are available.

Technical Support:  PHYTEC backs up our kits with a Start-Up Guarantee for the QuickStart Instructions included in Rapid Development Kits.  We invite you to make use of free support until any start-up problem you encounter is solved.  Talk to PHYTEC technical staff with every call.  No waiting for answers.  Paid support contracts are available for advanced support needs beyond the scope of the QuickStart Instructions and associated demo programs.

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2

Your Design Phase: Development

How PHYTEC Can Help

Don't spend weeks in specification, parts procurement, complex schematic rendering and layout of your own microprocessor circuitry.  Also forgo the need to build and test prototypes, followed by redesign iterations needed to yield production-ready hardware.  Purchase our commercial, off-the-shelf SBC subassemblies instead and let PHYTEC handle complex design issues, saving you time and money while reducing your opportunity costs and design risk.

"Portable" Processor Core: The COTS Advantage

PHYTEC SBCs are the core component in Rapid Development Kits. Following start-up of kit hardware and development of application code, the SBC module can be removed from the Carrier Board and designed like a "big chip" into prototypes, pre-production units and OEM products... making full use of its modularity and compact form factor.

The Carrier Board also serves as a reference design for development of your own target hardware in which the phyCORE SBC module is deployed. Schematics with BoM are available under a Non Disclosure Agreement (NDA).

Build our industry-proven, pre-tested SBC subassemblies into your target circuitry; interfacing to required peripherals according to your I/O, dimensional and physical interface requirements.

Make -or- Buy

Applying the principle of cost accounting, the actual cost of a development is not limited to direct material, but must include the cost and time needed for parts procurement, design, production, test, software and operating system adaptation, as well as support. 

Development issues and associated costs do not end with the manufacture of your microprocessor circuitry.  Test, support, warranty and maintenance are downstream issues that also must be considered.  Implementation of a PHYTEC Single Board Computer module removes these costs and risks from your design cycle.

 

Make or Buy Development Comparison

Development Issue	MAKE  (your own microcontroller circuitry)	BUY  (a PHYTEC off-shelf SBC module)
Specification	You specify the microcontroller core.	Select from PHYTEC‘s variety of COTS 8-, 16- and 32-bit Single Board Computers that cover a wide range of applications.
Parts Selection and Procurement	You select, procure and stock parts. You deal with small quantity procurement, second source and obsolesence.	PHYTEC handles all parts selection, procurement, stocking, second sourcing and obsolesence issues.
Design	You create schematic, placement and 6-12 layer PCB layout; deal with redesign issues and changes of specification.	PHYTEC has already designed EMI-resistant and continuously-enhanced “plug and play“ microcontroller cores.
Production/Assembly	You must ensure quality production of your microcontroller core.	PHYTEC provides ISO-9001production on state-of-the-art SMD assembly line (microBGA, 0402, dual-sided PCB assembly).
Development Tools	You must research supported compilers, port start-up code and programming algorithms, and select debugging tools.	PHYTEC provides bundled tools and BSPs for our SBC modules in applicable Rapid Development Kits.
Post-Production Issues	You must test, certify, support and warrant your microcontroller core at your own cost and risk.  You must ensure hardware compatibility in event of upgrade or obsolesence of any parts.	PHYTEC submits our CE-certified SBCs to functional and electrical tests.  PHYTEC provides support and warranty, ensures pin- and function-compatible migration paths in event of upgrade or including RoHS compliance.     obsolete parts on our SBCs.

 

Even if your material costs are less than the price of a PHYTEC subassembly in OEM quantities, amortizing all costs and design risk - including opportunity costs - over the quantity built yields the true cost of your development.  PHYTEC modules are cost-effective even at higher quantities (such as 10,000 units) and represent a very attractive entry point cost and ramp-up option for new embedded designs.

 

Make or Buy Cost Analysis

MAKE (your own microcontroller circuitry)	COST	BUY (a PHYTEC off-shelf SBC module)
$4.00 ($4,000 amortized over 1K)	Parts Procurement/Selection	$0.00 (included in unit cost)
$80.00 ($80,000 amortized over 1K)	Engineering/Design (including learning curve)	$0.00 (included in unit cost)
$112.15 (per unit material cost at 1K)	Microcontroller Core Material	$167.40 (off-shelf cost @ 1K)
$7.00 ($7,000 amortized over 1K)	Microcontroller Core Assembly	$0.00 (included in unit cost)
$6.00 ($6,000 amortized over 1K)	Test/Validation	$0.00 (included in unit cost)
$3.00 ($3,000 amortized over 1K)	Support & Post-Production	$0.00 (included in unit cost)
$35.50 (64 - 28.5 days @ $1000/day)	Opportunity (see Timeline on next page)	$0.00 (included in unit cost)
your per unit risk cost at 1K	Risk	$0.00 (included in unit cost)
$247.65	TOTAL	$167.40

Example Make - or - Buy Analysis for 32-bit ARM7 Single Board Computer Subassembly at 1K Quantity

 

At order quantities as low as 100 units, PHYTEC can customize board configurations - such as by removing unnecessary components and scaling memory densities - to best meet your cost objectives and technical requirements. These custom configurations are assigned a customer-specific part number suffix.

Save time and money as well as reduce design risk with PHYTEC off-shelf SBC subassemblies.

Beyond the SBC module

PHYTEC offers additional design services beyond COTS SBC modules and Carrier Board reference designs:

• design and manufacture of a custom carrier board for your end application
• development and manufacture of a "flat" board design in which our microprocessor circuitry is integrated onto a single PCB, rather than a two PCB solution consisting of an off-shelf PHYTEC module on a Carrier Board

For very high volumes, discuss with us a one-time, royalty-free design license buy-out of PHYTEC SBC circuitry, in the form of schematic and Bill of Material, for unrestricted use in your own embedded hardware development.

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3

Your Design Phase: Integration

How PHYTEC Can Help

To complement over 20 years of experience in board-level design, PHYTEC offers newly-expanded Design Services. These services include:

• OEM Integration Services
• Custom Hardware
• Custom Software

If you do not have the ability to design your target circuitry in-house, PHYTEC can design and produce this hardware for you. We also offer a wide variety of software services in conjunction with our tool partners.

OEM Integration Services

• System Design
• Development Tool Adaptation (Operating Systems, Compilers, Debuggers/Emulators)
• Integration of Single Board Computer Subassemblies into Target Hardware
• Custom-Specific (I/O) Subassemblies
• Board Support Packages (BSPs): Operating Systems, Device Drivers, OEM Adaptation Layer
• User Conformance, Certification, Test & Reliability Requirements (UL, CE, IPC, MTBF, J-STD, etc.)
• Start-up, Test, Validation
• Technical Support

Custom Hardware

• Semi-Custom Design with PHYTEC Single Board Computer Subassemblies
• Full Custom Design, Customer-Specific Board and Processor Kernel Designs
• Interconnection/Periphery Design on Custom Carrier Boards
• Standard Peripherals
• Start-up, Test, Validation
• Technical Support

Custom Software (Tool Partner Resources)

• Embedded Communication (CAN, TCP/IP, USB, etc.)
• Flash Programmers
• Operating Systems
• Board Support Package (BSP) Development
• Application Code Development
• Installation, Start-up, Test, Validation
• Software Maintenance
• Technical Support

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4

Your Design Phase: OEM Deployment

How PHYTEC Can Help

PHYTEC SBC modules are optimized for OEM deployment.  Our hardware addresses the challenges presented by quality assurance, design and software requirements, as well as supply and product maintenance issues.

Quality Assurance, Conformance & Certification, Reliability & Test: PHYTEC's internal quality control program encompasses all material, labor and production inputs. Our qualifications and standards include:

• ISO9001:2000
• RoHS-compliance
• IPC-600A-F class 2, 3 PCBs
• IPC-610A-D class 2 assembly
• J-STD-004 no-clean
• CE conformance
• VDA, KTA1401
• MTBF analysis

All PHYTEC hardware is subjected to AOI (Automated Optical Inspection), as well as visual inspection, functional test and electrical test following assembly.  All units passing test receive a unique serial number.

Low EMI Design

The phyCORE's compact form factor, increased pin package and multi-layer design improves its EMI (Electromagnetic Interference) characteristics and allows insertion of these SBCs into an even wider spectrum of user target hardware environments, including high noise environments.  phyCORE modules achieve their small size through advanced SMD technology.  Use of 0402-packaged SMD, laser-drilled Microvias and µBGA components on these subassemblies provides you with access to this cutting edge miniaturization technology for integration into your target hardware.

Small board size means short signal traces, further minimizing EMI susceptibility. In addition, 20% of all pins on the phyCORE's external connectors are tied to ground (GND).  This addresses independent research indicating that approximately 70% of all EMI problems stem from insufficient supply voltage grounding.

The top and bottom signal-routing layers of the 6- to 12-layer phyCORE PCBs feature a by-pass capacitor grid in which 1nF and 100nF capacitors are arranged in a checkerboard fashion, thus quickly driving all interference and other impedance to GND to further minimize EMI.

Mix-Speed Design

phyCORE SBC subassemblies support increasingly complex high-speed processors in progressively smaller packaging.  These ICs share PCB space with a diversity of other circuits with varying clock speeds and supply voltages.  PHYTEC has used our two decades of board-level layout experience to meet the challenges of high and mixed circuit speeds within a very dense PCB design.   

Selection of PCB base material and quartz crystals; optimal stackup for signal integrity, placement and grouping of components; as well as signal decoupling and routing topology across isolated PCB planes are among the foundations of our design integrity.  Our industrial board design has been verified by not only advanced layout and PCB simulation tools, but by high yields among our customer base in a wide range of OEM deployments.

Robust Interconnects

High-density 0.635 mm Molex SlimStack connectors are used to interface most phyCORE modules to target hardware.  These connectors offer advantages of numerous mating cycles, SMT tails that create strong solder fillets, a friction locking feature for added mating retention, as well as reliability under severe shock and vibration.  The high-pitch connector provides ample pins to tie 20% to GND.  Deploy these production-ready BSPs with our insert-ready SBCs.... and save time and money as well as reduce design risk in terms of both software and hardware development.

Industrial Temperature Range

In order to ensure deployment in a wide range of industrial applications, most phyCORE SBC subassemblies are available in an industrial temperature range (-40… +85°C).  Reduced cost commercial range configurations are also optionally available.

Production-ready BSPs & Drivers

Bundled Linux and Windows Embedded CE Board Support Packages (BSP) further provide immediate Out-of-Box support of, and drivers for, all essential hardware features.

Flexible Production

The automated assembly line at our German parent company handles advanced SMD assembly of miniature 0402, 0.4mm pitch µBGA and Microvias components on dual-sided 6- to 12-layer PCBs.  Our in-house production enables us to offer cost-effective and high mix production runs for all lot sizes, including smaller quantities.  Backed by our expansive stock of both parts and finished goods, this allows for maximum flexibility in production scheduling and minimized lead-times.

Customization

Our in-house design and production enables us to offer customer-specific configurations of our SBC modules.  At Minimum Order Quantities (MOQs) as low as 100 units, PHYTEC can customize our SBC subassembly configurations to best meet your cost objectives and technical requirements.  These configurations are identified by a unique customer-specific suffix attached to root part numbers.

Demand-Pull & Buffer Stock

Product quality is only one facet of customer satisfaction.  Accordingly, PHYTEC ensures adherence to customer deadlines and demand requirements by establishment of buffer stock and demand-pull programs.  For large-volume OEM customer demand, we offer domestic assembly and test of PHYTEC subassemblies at our Texas-based production partner, Variosystems.  Domestic assembly increases our flexibility and output capacity while minimizing exchange rate and transit issues associated with import shipments of PHYTEC SBCs made at our German facility.

Product Maintenance

Use of "drop-in" PHYTEC SBC modules also ensures interchangeable microprocessor core circuitry in the event of obsolescence of parts used on our SBCs.  You no longer need to redesign your entire circuitry to accommodate new or obsolete parts.  Instead, PHYTEC manages this at the level of the external pinout of our SBC modules.  We ensure continued availability of pin- and function-compatible modules, further minimizing your maintenance costs and risks.

RoHS

PHYTEC certifies that the PCBs, all components and solder profiles used in manufacture of our SBC subassemblies conform to the European Union "Restriction on the use of certain Hazardous Substances 2002/95/EC” (RoHS) directive.

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