News and Press Releases

PHYTEC Announces phyCORE-i.MX35 ARM11 SOM

Date : Dec. 18, 2009

PHYTEC America LLC announces the release of its new phyCORE-i.MX35 System On Module (SOM) and phyCORE-i.MX35 Rapid Development Kit (RDK).

PHYTEC press release -  View »

Microsoft Partner Award

Date : Oct. 6, 2009

PHYTEC America LLC announced that it has received a 2009 Windows Embeddded Partner Excellence Award for the Americas for the third consecutive year. PHYTEC received this award in the Independent Hardware Vendor category at the Window Embedded Partner Program summit in San Francisco, CA.

PHYTEC press release -  View »

PHYTEC announces availability of Windows Embedded CE 6.0 R3 BSPs

Date : Oct. 5, 2009

PHYTEC America announces that all PHYTEC System on Module hardware, Rapid Development Kits and Board Support Packages (BSPs) are fully compatible with the new 6.0 R3 version of Microsoft’s Windows Embedded operating system.

PHYTEC press release -  View »

phyCORE-i.MX35 ARM SOM - Coming Soon

Date : May, 1 2009

The phyCORE-i.MX35 is an insert ready System on Module which supports ARM11 with on-ship Ethernet, USB, LCD, VFP, CAN and Image Processing Unit.  Learn More »

phyCORE-LPC3250 RDK with Linux available

Date : April 24, 2009

The Linux version of the LPC3250 Rapid Development Kit is now available. The RDK (Part # KPCM-040-Linux) includes a System on Module, Carrier Board, Bare PCB Expansion Board, cables, SD card with demo images, a PHYTEC Kit CD with hardware manual, data sheets, Quickstarts and software demos, plus a start-up guarantee.  Learn More »

Microsoft Partner Award

Date : June 4, 2008

PHYTEC America LLC announced that it has received a 2008 Windows Embeddded Partner Excellence Award for the Americas. PHYTEC received this award in the Independent Hardware Vendor category at the Tech•Ed North America 2008 Developers Conference.

The Windows Embedded Partner Excellence Awards recognize visionary organizations around the world that use Windows Embedded technology in innovative and creative ways.

This Excellence Award acknowledges PHYTEC’s commitment to the Windows Embedded platforms and exceptional participation in the Windows Embedded Partner Program as a registered partner. 

PHYTEC press release -  View »
Microsoft press release -  View »

phyCORE-LPC3250 ARM9 SOM - NEW

Date : April 21, 2008

PHYTEC announces the release of its new phyCORE-LPC3250 System on Module (SOM) subassembly. The phyCORE-LPC3250 is an ARM9 based, small form factor (70x58 mm), OEMable module populated with the NXP LPC3250 microcontroller. The LPC3250 can operate in ultra-low-power mode down to 0.9V. The State-of-the-art power management, Floating Point Unit, and rich peripherals such as SD/SDIO, USB OTG, Ethernet, SDRAM, NOR and NAND Flash memory, and integrated LCD controller make this module the ideal candidate for embedded applications requiring feature-rich high performance and low power consumption. The phyCORE-LPC3250 is particularly suitable for consumer, industrial, medical, and automotive applications. The on-board MMU supports major operating systems, including Linux and Windows Embedded CE R2.

PHYTEC press release -  View »

phyCORE-LPC3250 ARM 9 SOM with WinCE R2

Date : April 21, 2008

PHYTEC announces the release of its new phyCORE-LPC3250 System on Module (SOM) subassembly. The phyCORE-LPC3250 is an ARM9 based, small form factor (70x58 mm), OEM-able module populated with the NXP LPC3250 microcontroller. The LPC3250 can operate in ultra-low-power mode down to 0.9V. This state-of-the-art power management, Floating Point Unit, and rich peripherals such as SD/SDIO, USB OTG, Ethernet, SDRAM, NOR and NAND Flash memory, and integrated LCD controller make this module the ideal candidate for embedded applications requiring feature-rich high performance and low power consumption. The on-board MMU supports the Windows Embedded CE R2 operating system, making the phyCORE-LPC3250 particularly suitable for deployment in a wide range of consumer, industrial, medical, and automotive applications.

PHYTEC press release -  View »

Windows Embedded CE 6.0 R2

Date : December 21, 2007

PHYTEC, a Gold Partner in the Windows Embedded Partner Program with facilities in Europe and in the USA, announces the full compatibility of PHYTEC Rapid Development Kit hardware with the new 6.0 R2 version of Microsoft’s Windows Embedded operating system. In addition, BSP source code for PHYTEC hardware is available in an innovative distribution model. This is in cooperation with our software partner Adeneo, providing free access to source code for evaluation.
Presently available Rapid Development Kits with full Windows Embedded CE 6.0 BSP support are:

• phyCORE-i.MX31 Rapid Development Kit  Learn More »
• phyCORE-PXA270 Acceleration Kit  Learn More »
• phyCORE- PXA270 Rapid Development Kit  Learn More »

PHYTEC press release -  View »

phyCORE-i.MX31 SOM with WinCE 6.0

Date : November 5, 2007

PHYTEC announces the release of its new phyCORE-i.MX31 System on Module (SOM) subassembly. The phyCORE-i.MX31 is an ARM-11 based, small form factor, OEMable module populated with the Freescale i.MX31: a high performance multimedia applications processor. Graphics acceleration, state-of-the-art power management, Floating Point Unit, and rich peripherals such as Ethernet, High Speed USB, and integrated LCD controller make this module the ideal candidate for Windows Embedded CE device applications.

The phyCORE-i.MX31 is available in a kit that offers a true rapid development solution by providing all the necessary ingredients to jump start embedded design. The phyCORE-i.MX31 Rapid Development Kit includes the module and carrier board, 3.5" color LCD with integrated touch, Windows Embedded CE 6.0 OS demo image, and all the contents required to enable users to successfully set-up target hardware and build and load a Windows Embedded CE binary image with Platform Builder. The Windows Embedded CE BSP source code is available from Adeneo, a Windows Embedded gold partner of Microsoft which focus on providing strong expertise's such as consulting, training or engineering services to OEMs.

PHYTEC press release -  View »

Acceleration Kit for Microsoft WinCE 6.0

Date : October 29, 2007

PHYTEC and Adeneo announce a new low cost Acceleration Kit for Microsoft Windows Embedded CE 6.0. The Acceleration Kit includes the ARM-core based phyCORE-PXA270 module and carrier board; LCD with integrated touch panel; Windows Embedded CE 6.0 Board Support Package (BSP) source code access; and all the contents required to enable users to successfully set-up target hardware, build and load a Windows Embedded CE image with Platform Builder, and start developing with Windows Embedded CE on a powerful development platform.

PHYTEC press release -  View »

New Windows Embedded CE 6.0 Support

Date : June 4, 2007

PHYTEC and Adeneo, both Gold level members of the Microsoft Windows Embedded Partners Program, released to the market today a Board Support Package (BSP) for Microsoft Windows Embedded CE 6.0 for the phyCORE-PXA270. The phyCORE-PXA270 is a small, feature rich, insert-ready module based on the XScale PXA270 applications processor from Marvell. The phyCORE module integrates features like Ethernet, CAN, and Audio/Touchscreen codec, offering all the features required for strong multimedia and high bandwidth communication applications. The BSP, with integrated drivers for all standard interfaces available on the module, enables application developers to port their Windows CE based software onto the phyCORE module with minimal development effort and risk. PHYTEC's phyCORE-PXA270 Rapid Development Kit along with Adeneo's BSP is the key starting point for OEMs developing smart Windows Embedded CE based devices and offers a robust solution for OEM's needing to have a complete Windows Embedded CE solution up and running under very short development time.

PHYTEC press release -  View »

PHYTEC Attains Gold

Date : May, 31, 2007

PHYTEC America LLC announces that it has attained Gold level membership, the highest level in the Microsoft Windows Embedded Partner (WEP) Program. This achievement highlights PHYTEC's ability to demonstrate excellence in building and enabling Windows Embedded-powered products. Microsoft Gold Partners receive a rich set of benefits, including greater access to technical and marketing resources, as well as training and support from Microsoft, giving them a competitive advantage in the embedded marketplace.

PHYTEC press release -  View »

Microsoft Partner Award

Date : May, 1 2007

PHYTEC America LLC today announced that it received the North American Windows Embedded Partner Excellence Award 2007. PHYTEC received this award in the Registered Partner category on April 30, 2007, as part of Microsoft's Mobile & Embedded Developers Conference.

The Windows Embedded Partner Excellence Awards, previously called the Windows Embedded Partner of the Year Awards, recognize visionaries and organizations around the world that use technology in an innovative and creative manner to revolutionize their businesses and society as a whole.

This Excellence Award acknowledges PHYTEC’s commitment to the Windows Embedded platforms and exceptional participation in the Windows Embedded Partner Program as a registered partner.

PHYTEC press release -  View »