PHYTEC Manufacturing

Over 25 years experience

We offer a unique manufacturing model. Our multiple lines and efficient resource planning allow us to offer high levels of customization while maintaining quality and throughput.

PHYTEC utilizes a High Mix Low Volume production model allowing configuration and schedule flexibility

We have an annual production throughput of nearly one million Printed Circuit Board Assemblies (PCBAs) at our in-house plant and partner facilities. Our internal manufacturing equipment, ISO9001:2015-certified processes, optimized component purchasing and Enterprise Resource Planning (ERP) system enable us to cost-effectively and flexibly manage high-mix, low-to-medium volume (HMLV) manufacturing. This HMLV approach best supports our wide product palette, as well as best meets the delivery demands, quality requirements and customization needs of our diverse customer base.  Alliances with external production partners enables cost-optimization and scalability to 100K annual production volumes of such high-volume PCBAs.

SMT Production

In-House Surface Mount Technology (SMT) Production

  • 6x fully automatic Solder Screen and Stencil Printers with built-in stencil cleaning paste and 2½ D visual inspection
  • 2x EKRA X3
  • 3x Ekra X5
  • 1x Ekra E5

3x Automated Post-Solder Solder Paste Inspection (SPI) Systems, with 100% sample rate

  • 1x Kohyoung Zenith
  • 1x Viscom S3088 Ultra
  • 1x Viscom 6034

Pre-Solder Automated Optical Inspection (AOI)

  • 1x Viscom S3088 AV

Solder Paste Inspection (SPI) Systems, in-line and off-line

  • 2x Kohyoung Aspire
  • 1x Kohyoung KY-3020T

8x Vapor Phase Reflow Soldering Systems

  • 5x ASSCON VP-2000 batch soldering system configured for lead-free solder (230 ˚C Galden medium), 2 of which are double-track
  • 1x ASSCON VP-64 batch soldering system configured for lead-free solder (230 ˚C Galden medium)
  • 1x ASSCON VP-56 batch soldering system configured for lead-free solder (230 ˚C Galden medium)
  • 1x ASSCON VP-53 batch soldering system configured for leaded solder process (200 ˚C Galden medium)

6x Pick n/ Place SMT Lines: Hanwha Techwin (formerly Samsung C&T Automation)

  • Line 00 (prototype): 1x SM421 with nominal loading capacity of up to 30,000 CPH (components per hour placement) per IPC 8950
  • Line 01: 1x SM411, 1x SM421 with 45,000 CPH
  • Line 02: 1x SM471, 1x SM421 with 50,000 CPH
  • Line 03: 1x SM471, 1x SM482 with 50,000 CPH
  • Line 04: 1x SM471, 1x SM482plus with 55,000 CPH
  • Line 05: 1x SM471plus, 1x SM482plus with 10,000 CPH

Selective Soldering

  • 2x Zipatec Select 250
  • 1x Zipatec Select 460

Automatic Optical Inspection (AOI)

  • 1x Viscom inspection systems with 1x orthogonal and 4x oblique cameras. Each solder joint is checked for solder paste printing, short circuit, cold solder joints, tombstones, reverse polarity and shift. 


  • Phoenix Microme x-ray system..  A 1% sampling of all hardware on our lines is x-rayed for identification of missing of fillets, pores and voids, solder, and icicling.
  • Maximum inspection area of 610 x 560 mm, detail detectability of 1μ and maximum tube voltage of 180 kV / 20 W
  • Automatic calculation of pore structures for multichip
  • Oblique 0˚ – 70˚, rotation 0˚ – 360˚

Through Hole Technology (THT) Production

Wave Soldering

  • 2x ERSA EWS-330 with spray fluxer
  • System configured for conventional leaded solder
  • System with nitrogen and titanium pot cover configured for lead-free SAC solder 


PHYTEC offers 100% traceability in a MySQL test result database.  All units are provided with a unique serial number upon passing of the following tests:

  • Boundary Scan
  • Göpel proprietary framework for functional testing, including voltage and current measurements

Selective Soldering

  • 2x Zipatec Select 250 with selective solder pot changes for conventional solder and lead-free SAC solder
  • 1x Zipatec Select 460

Quality Control

PHYTEC’s internal quality control program encompasses all material, labor and production inputs. View our qualifications and standards here

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